Telecommunication and automotive applications require high-volume and low-cost circuit fabrication, while at the same time demanding excellent electrical performance, reliability, circuit miniaturisation and surface mounting techniques. Low Temperature Co-fired Ceramics (LTCC) technology has recently become one of the most promising heterogeneous integration technologies. In this technology, passive components, such as inductors, capacitors and filters, are integrated into multilayer LTCC substrate.

The most important features of LTCC are:

• low costs, high density and high degree of component integration;
• flexibility of the design of various 3D structures;
• very good reliability and hermeticity of the circuit (important in the case of vacuum circuits or those operating in liquids or during operation in conditions of potential explosion);
• possibility of fabricating LTCC structures with integrated temperature control (cooling or heating circuits with a system of temperature sensors);
• resistance to high temperatures;
• possibility of fabricating electronic circuits, integrated sensors and converters, as well as the package during a single process.